Amphenol Overview
Analysis of Direct-to-Package 224G Channels Achieving 224Gb/s over copper interconnects presents multiple challenges.
Product Portfolio New High Speed Backplane Products (2021)
Product Portfolio Storage & Server IO Connectors (2021)
Product Portfolio Storage & Server IO Connectors - Chinese (2021)
Product Portfolio Commercial Industrial (2021)
Product Portfolio High Speed IO & OverPass Technology (2021)
Product Portfolio High Speed Cable Assemblies (2021)
Product Portfolio FCI Basics High Speed Solutions (2021)
Product Portfolio TR Multicoax, HCTF, & micro-LinkOVER (2021)
Tech Demo Newest Gen Paladin Connector Series (2021)
Tech Demo OSFP 112G Chip to Chip Channel Cables (2021)
Tech Demo ExaMAX2 Cable Assembly Running at 112G (2021)
Tech Demo Mini Cool Edge IO Cable Assembly, 112G PAM4 Signal (2021)
Tech Demo QSFP DD & OSFP 800G Host Compliance Test Fixtures (2021)
Tech Demo 112G Mini Cool Edge Connector with MultiLane (2021)
Windowing and Rise time What is the rise time of a system given a specific windowing function?
User Manual - Crimping Tool Crimping tool for Minitek Microspace™ 1.27mm, 1.50mm and 1.80mm Crimp-to-Wire Connector
Zhaga Book 20 Zhaga book 20 lighting standard - the smart interface between indoor luminaires and sensors and communication modules
Single Pair Ethernet visions: AMPHENOL Introducing the members of the SPE Industrial Partner Network: AMPHENOL
EazyPwr™ Connectors The connector family provides fool-proof install and field termination capability
ExaMAX2 Backplane Connector Demonstration that showcases the robustness of ExaMAX2 in all demate conditions
Lynx QD Connector 56G product demo through Lynx QD
QSFP DD OverPass and Cable Assembly Solution for 112G 112G per Lane QSFP DD and microLinkOVER with Cadence
High Speed Cable - Mini Cool Edge IO This Cable Assembly is designed for PCIe Gen 3, 4, 5, and also being developed for 112G PAM4
Griplet® Miniature IDC Connectors Reliable connection and ease of installation for Wire-to-Board terminations
DesignCon 2018 Amphenol WalkThrough
DesignCon 2018 Paladin 112Gbps Interconnect Channel
DesignCon 2018 112G PAM4 with Mini Cool Edge Connector with Credo Semiconductor
DesignCon 2018 32G NRZ with PCIe Gen5 Connector with MultiLane
DesignCon 2018 300Gbps Embedded Optical Transceiver
DesignCon 2018 Data Center Cabling, Active Copper
DesignCon 2018 ExaMAX+ 8 Pair DMO Connector System
DesignCon 2017 Paladin DMO Running 50G NRZ with Credo
DesignCon 2017 Paladin DMO
DesignCon 2017 ExaMAX
DesignCon 2017 ExaMAX Standard Backplane 56G PAM4
DesignCon 2017 ExaMAX Plus DMO 112G PAM4 with Credo
DesignCon 2017 ExaMAX Backplane 56G PAM4 with Credo
DesignCon 2017 ExaMAX Plus DMO 112G PAM4
DesignCon 2017 Cable Backplane
DesignCon 2017 OSFP
Millipacs® High Speed Connectors Millipacs® is a 2.00mm modular, Board-to-board and Cable-to-board Interconnection system....
VerIO™ Connector A versatile, robust and compact I/O system featuring multiple standard connector interfaces such as RJ45, PoE, Signal, Power and Hybrid.
Minitek Microspace™ Crimp-to-Wire Connector Minitek MicroSpace™ Crimp-to-Wire connector platform's unique design enables LV214 Severity-2
OCTIS™ - Outdoor IO System The versatile OCTIS™ I/O system, using multiple industry standard interfaces.
OCTIS™ - Power Cable Assembly The OCTIS™ Power version is suitable for high power applications.
DesignCon 2016 - Highlights DesignCon 2016 - Highlights from Amphenol FCI
Demo at DesignCon 2016 100Gb/s Active Cables & 56Gb/s Backplane Solutions with BiFast
Demo at DesignCon 2016 Power Solutions Demo
Demo at DesignCon 2016 QSFP Cable Assembly with Texas Instruments
Demo at DesignCon 2016 ExaMAX® Demo with Avago
Demo at DesignCon 2016 ExaMAX® Demo with Credo
PwrBlade+™ - Slide-to-Lock FCI's PwrBlade+™ - Slide-to-Lock demonstration

Other Video

Amphenol FCI India Introduction to Amphenol FCI India