符合最新JEDEC SO-023接口标准

安费诺垂直0.85毫米间距DDR5 DIMM插槽提供288个触点,专用于插接符合JEDEC MO-329标准的DDR5内存模块。此系列插槽可为服务器、工作站、台式机以及通信和工业设备中的嵌入式应用提供良好的内存扩展支持。

  • 可承受更高水平的系统级冲击和振动测试模块重量
  • 便于插拔模块卡
  • 支持更厚的多层主板
  • 优化气流
  • 符合环保要求
特性 优点
  • 间距更小,工作电压更低
  • 降低能耗
  • 支持更高的数据速率
  • 传输速度更快
  • 超薄型设计
  • 节省占板空间
  • 减小插接力
  • 便于模块卡拔插
  • 壳体和闩锁提供不同颜色选项
  • 有助于快速识别PCB
  • 提供窄闩锁选项
  • 通风效果良好

Everything you need to know about DDR5 RAM

Memory standards are redefined dynamically to meet the emerging needs of advanced computing. High density, high speed, low operating voltage, and quick access are some of the key features that determine the efficacy of a memory.

The evolution of random access memory has been a continuous process. From SDR SDRAM (Single Data Rate Synchronous Dynamic Random Access Memory), capable of transferring a single data signal per cycle, to DDRs introduced to improve the speed and efficiency of data transfers. Although SDR SDRAM was capable of transferring data through both the leading edge and the falling edge of the clock, making it twice as fast as SDRAM, it was with the introduction of DDR that memory could run at a lower clock rate at faster speeds using lesser energy.

Generations of DDR

The evolution continues to the newer generation of DDR from DDR2 to DDR3, DDR4, and now the latest DDR5. With a clock multiplier that doubles data transfer speeds and operating at the same bus speed, DDR2 was a revolution back then. But as speed requirements increased, DDR3 was rolled out. By 2014, the higher speed variant of DDR3, that is the DDR4 standard was introduced to perform to lower voltage requirements, higher density and a brilliant data transfer speed of 2133 to 3200 MT/s as compared to 800 to1600 MT/s transfer speeds of DDR3.

Features of DDR5

JEDEC, the organization developing the features and timely announcement of standards,have now announced the latest, fastest, and most efficient so far, the DDR5 standards. The DDR5 standard is expected to address the ever-growing demand from AI and machine learning to advanced datacenter and cloud environments.

DDR5 standard is expected to support a four-fold increase in density with maximum density expanding from 16 Gigabits per die to 64 Gigabits per die. The new specification will also come with an expanded data transfer range from 3200 MT/s to 6400 MT/s, which is 16x faster than the SDRAM. Another great feature of DDR5 is that they come with a further reduced operating voltage of 1.2V compared to 1.1V of DDR4.

Benefits of DDR5

DDR5 works with a write pattern command, which is a power saver, as it avoids sending data across the bus. The DDR5 specification also increases stacking capability, doubling the height from the previous generation. A new feature, Decision Feedback Equalization, was added to improve IO speed scalability helping in building high-frequency interfaces.

DDR5 Same Bank Refresh

"Same Bank Refresh" is another significant feature introduced for DDR5. In the previous generation including DDR4, even if a single bank was to be refreshed, the system could perform only with refreshing all the banks simultaneously. This left the CPU to wait to perform other operations while refreshing, affecting the performance of the whole system.

Previously there were 16 banks in the DIMM which are improved to 32 in the new specification. With the "Same Bank Refresh" feature, each memory bank can refresh independently, without affecting the function of other banks, which improves the performance significantly.

Specialty of DDR5

The additional features of DDR5 include scaling features like on-die ECC that permit advanced process nodes manufacturing. The MIPI Alliance I3C Basic specification, which is used for system management bus and DIMM design, comes with a voltage regulator that allows pay as you go scalability, with enhanced voltage tolerance. This improves DRAM yields and reduced power consumption.

Amphenol's DDR Connector Solutions

Amphenol has always provided interconnect solutions to meet the requirements of all DDR conenctor generations. DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor that allows fitting into smaller chassis, aiding the development of smaller and lighter notebook PC. It is offered in 2.5V and 1.8V voltage rating options.

With data rate of 4.8Gb/s and 20.8mm connector height, Amphenol's DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. DDR3 also features low-resistance contacts that support the use of RDIMM (Registered DIMM), which helps to further reduce power consumption in data center hardware.

Amphenol's Advanced DDR4 Connectors

Being half the size of regular DIMMs, DDR4 SO-DIMM connectors exhibit lower power consumption and promote better thermal management. These 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, and 8.00mm, 9.20mm height, in standard or reverse options.

Amphenol also offers DDR4 Ultra Low Profile (ULP) vertical DIMM sockets with 288 contacts on a 0.85mm pitch. As these connectors offer multi-tail lengths, and support 1.6mm and 2.4mm motherboard heights, they facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment.

Amphenol's Latest DDR5 Connector

Amphenol provides DDR5 Memory Module Sockets (SMT) for emerging next generation designs. Vertical DDR5 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR5 memory modules that conform to JEDEC MO-329. These are capable of withstanding high-level system-level shock and vibration testing module weight

We also offer standard and narrow latch versions for DDR5 products. The narrow latch version can help to facilitate more airflow as the DIMM sockets are expected to be placed next to each other.

Amphenol also offers the SO-DIMM version of DDR5, click here to learn more.