Amphenol ICC recently launched the OverPass^™ solution which is a  cable system that allows customers to efficiently take high speed signal from near the CPU or ASIC to anywhere in their system. While providing enhanced performance, OverPass^™ can lower system costs. This is done by reducing or eliminating the need for expensive active devices like retimers, and high performance board materials.

High speed signals are transferred to twinax cables shortly after they are launched from the ASIC with the help of OverPass^™ cable systems. This creates a direct link to pluggable modules anywhere in the system without any signal loss. System designers can also optimize key parameters like signalling speed, density, and system heat management to create multiple interfaces.

In data center architecture, data is transmitted from switches to servers through high speed cables to the panel end of the server PCB. OverPass^™ system takes the signal from panel end further to the mid-board, establishing connection to CPU/ASIC. This helps to effectively bypass the board traces resulting in reduced transmission loss. Amphenol ICC connects high speed cables to mid board with industry standard I/O interfaces like QSFP/Mini SAS HD at the panel end and multiple mid-board connector options like SlimSAS/Slim Cool Edge at the CPU/ASIC end.

Low profile, high-density cabling solutions are offered in various configurations including straight, right angle, and coplanar.  Our high-speed, low-loss bulk cable solutions provide optimized wire performance that aids wire management, termination, and routing. Cable constructions include double ended, Y, and breakout cables. High-speed solutions are available in 10Gb/s, 28Gb/s, 56Gb/s, 112Gb/s PAM4 per lane signalling speeds.

Come visit Amphenol ICC at ODCC Summit booth C16 to discover how OverPass^™ solutions can optimize the efficiency of your server design.