Advanced electronic applications are in constant need of next-generation chip-to-board, flex-to-board, and board-to-board interconnection technology. From applications that require improved thermal performance and high-speed performance to latest semiconductors, various technologies trust the integrated design features of the cLGA packages.

PCBs are boards made of a non-conductive material which has conductive lines printed or etched on it. Electronic components are mounted on the board and the traces connect them together to form a working circuit. An effective PCB design is vital in determining the performance of any device. There are many parameters which affect the efficiency of a PCB. 

Industry 4.0, also called the 4^th industrial revolution, refers to the digital transformation of manufacturing; where humans, computers, and automation will come together and interact in entirely new ways.

The Industry 4.0 movement looks to re-shape the way factories are run today by converging autonomous machines and robotics with third platform technologies such as, Big Data/Analytics, the Internet of Things, cloud computing , artificial intelligence, and much (阅读更多)

Specifically designed to address the challenges associated with the deployment of 4G+, LTE+ and emerging 5G in the Telecom market, OCTIS™ provides a robust I/O interconnect solution that can operate in challenging outdoor and harsh environments. The versatile OCTIS™ I/O system is offered with multiple industry standard interfaces like  SFP/ SFP+, QSFP, Signal, Power and Hybrid. 

Introduction of Cool Edge connectors is a revolutionary move by Amphenol ICC in data center engineering. The Cool Edge family started to expand with different pitches and higher performance with each new addition to the product series range. When the standard connectors offer a fine pitch of 0.8mm and 0.65mm, it helps in reducing the PCB footprints along with enhancing the efficiency.