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112G State of the Union
IEEE and OIF are leading the drive to higher data rates, and other standards organizations are looking to them for guidance to transition to higher data rates. Channel definitions for 112Gb/s criteria are finishing up and 224Gb/s is on the far horizon. The 112Gb/s channel definition for backplane, mezzanine, and within chip architectures are all approved. The chip-to-chip and chip-to-module applications are still being refined, but are near completion.

The industry defines a working 112Gb/s channel within these standards. A channel is comprised of the SERDES transmission and receive impairments, the SERDES board attach geometry, and all the physical connections between commonly called a link. The pieces of each link are unique for each architecture. A backplane, for example, is three sets PCB traces connected with two connector systems.

What constitutes a 112G solution?
If a component is shown to work within a given channel, it is a valid solution for 112Gb/s application. Amphenol has 112Gb/s connector solution for every application that requires a connector. Paladin® and ExaMAX® are used for mezzanine and traditional, cabled, and orthogonal backplane. Amphenol SFP, SFP DD, QSFP, QSFP DD, and OSFP connectors and cable are available for 112Gb/s applications. We also have solutions for more niche applications. For example, Mini Cool Edge and Swift support 112Gb/s channels with card edge interconnectivity.

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112G High Speed Solutions


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Amphenol’s 10G+ High Speed Solutions

If you’re looking for something other than 112G, reference Amphenol’s full range of High Speed Products, from 10Gb/s and up